Hot bar Reflow Soldering
 Hot bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated with heating element (called a thermode or a Hot bar) to a sufficient temperature to melt the solder. After this the parts are cooled below the solidification temperature to form a permanent electro-mechanical bond.
The Hot bar Reflow Soldering process
For components that require a very precise positioning, Hot bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode (or Hot-bar) which is heated and cooled down for each connection. Pressure is applied during the entire cycle including heating, reflow, and cooling. Because pressure is applied during the complete cycle, the process is very suitable for parts that could disconnect during cooling down.
By using Hot bar Reflow Soldering process multiple connections (up to > 100mm length) can be made simultaneously in a single process cycle. Making these connections simultaneously also prevents wires disconnecting while soldering the neighbouring one.
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Hot bar Reflow Soldering Benefits:
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Fast temperature ramp-up and cool-down
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Closed loop temperature control
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Accurate positioning of the parts
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Multiple connections can be made simultaneously
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Cost effective due to elimination of third component such as connector
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Applications in Hot bar Reflow Soldering
Typical application examples are connecting fex-foils to Printed Circuit boards, small wires, small coax cables and very light or small components.
Our proven technologies enable the Automotive, Electronics & Solar Cells, IT & Multimedia, Medical, Aerospace and Defence industries to supply a variety of Hot bar Reflow Soldering applications. Our Miyachi Europe Hot bar Reflow Soldering products are designed especially for hot bar soldering of flex circuits, TAB and flexible connectors onto PCB's.
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