Heat-Sealing/ACF Final Bonding

The process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils is referred to as Heat-Sealing or ACF Final Bonding. The essential characteristics of this process are heating and cooling of the adhesive under pressure. 

Small adhesive particles or spheres are suspended in the adhesive, which can be in the form of foil, flex or paste. Before bonding the particles are separated by an isolating matrix of adhesive. The parts to be joined are first brought together with the adhesive in between. Temperature, time and pressure are applied and cause plastic deformation of the adhesive and compression of the particles. The particles that are trapped between the conductors form a conductive interface between the pads on the two mating surfaces and conduct only in the Z axis. Subsequent cooling and full curing of the adhesive while still in the compressed condition stabilise the joint. 
 

 Anisotropic Conductive Adhesive Bonding is divided in two techniques:

• Heat-Seal Bonding
  The Heat-Seal Bonding process is applied with flex materials, using adhesive pre-printed on the connector foil / flex foil.

• Anisotropic Conductive Film bonding
  The ACF Bonding process is iused for fine-pitch applications (> 30 mircon) as the particle size is smaller than those of heat seal connectors (HSCs).

Applications in Heat-Sealing/ACF Final bonding
Our proven technologies enable the  Automotive, Medical, Defence, Aerospace, Electronics & Solar Cells, IT & Multimedia industries to heat-seal a variety of applications.