ACF Laminating/Pre-Bonding

Miyachi Europe offers ACF Laminating/Pre-Bonding as a proven technology integrated in our systems. A well-known application of ACF Laminating/pre-Bonding is connecting flex-foil to glass or flex-foil to PCB.

ACF Bonding (Anisotropic Conductive Film)
The ACF Bonding process is used for fine-pitch applications (> 30 mircon), as the particle size is smaller than those of heat seal connectors (HSC's). The ACF Bonding process is a two- or three-step process:

Step 1: ACF Laminating / Pre-Bonding
The ACF material is supplied as a reel and consists of adhesive filled with conductive particles and a protective layer. Prior to ACF Laminating/Pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. Cutting is done using the half-cut method where on the actual ACF material is cut, the cover-layer is used for tape transport. The ACF is now positioned over the bond surface, by placing the thermode
(Hot bar) on the ACF material the ACF Laminating/Pre-Bonding is achieved.

Step 2: Pre-Bonding of parts (not always required)

Step 3: ACF Final Bonding
Once ACF Laminating/Pre-Bonding is completed and the flex has been aligned to match the traces on the substrate, the thermode (Hot bar) is again actuated and the parts heated to bonding temperature for the ACF Final Bond cycle. 

ACF Laminating/Pre-Bonding Benefits:   Small pitch possible   Electrical connections to glass   Lead-free process   Flux-free process   No cleaning required after process

Applications in ACF Laminating/pre-Bonding
Typical ACF Laminating/pre-Bonding application examples are connecting flex-foils to Printed Circuit boards (used in IT & Multimedia) detector modules, displays, etc. Our proven technologies enable the Automotive, IT & Multimedia, Electronics & Solar Cells, Aerospace, Defence and Medical industries to supply a variety of applications in ACF Laminating/pre-Bonding.