Hot bar System
 Miyachi Europe Hot bar systems can be used for Hot bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking. Hot bar systems include constant heat or pulsed heat process technology.
Using the Thermode technology as the heart of our Hot bar system with precise temperature, force and process control, the Miyachi Hot bar systems create a robust and multi-functional platform for Hot bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking applications.
These processes are the preferred solution for Reflow Soldering thermally-sensitive components such as computer chips and connectors. The same Hot bar systems are also ideal for Heat-Sealing / ACF Bonding of flexible connections between LCD and PCB components and Heatstaking of plastic modules. Miyachi Europe designs and produces a full range of automated workstations for both processes.
In addition to our range of standard systems, Miyachi Europe offers equipment modifications for existing specifications and customised systems to meet your specific needs.
Contact Miyachi Europe to find out how to implement a Hot bar system intoyour production process.
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Hot bar System Configurations
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Hot bar System Benefits:
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Turn-Key deliverables
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Customised Hot bar application solutions
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On-site system integration, qualification and training
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Applications expertise and global support
Hot bar System Features:
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Process data traceability and storage
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Alignment and positioning modules
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Visual inspection systems
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Functional product-test modules
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Dispensing modules
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Parts feeding
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Product handling and positioning
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Closed loop process quality control
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Process development
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Our proven technologies enable the Automotive, Electronics & Solar Cells, IT & Multimedia, Medical, Aerospace and Defence industries to laser weld a variety of applications.
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