Hot Bar
Miyachi Europe Hot Bar systems can be used for Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking. Hot Bar systems include constant heat or pulsed heat process technology.
Hot Bar Systems
Using the Thermode technology as the heart of our Hot Bar system with precise temperature, force and process control, the Miyachi Hot Bar systems create a robust and multi-functional platform for Hot Bar Reflow Soldering, ACF Bonding, Heat-Sealing and Heat Staking applications.
Hot Bar Relow Soldering
Pulsed-Heated Hot Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts and solder.
Learn more about:
