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The growing use of heavy-duty electronic devices and components in motor vehicles has led to increased use of previously unused or only rarely used bonding methods [1]. While soft soldering and crimping were the most frequently used methods until just a few years ago, these methods are today reaching the limits of their possibilities due to the steady increase in power density in the devices. Soft-soldered connections are dependable up to approximately 125°C, whereas crimp connections are subject to aging with rising contact resistance as they get older.
The same applies to numerous electronic devices, whose functional density is increasing as their size and weight fall, e.g. portable electronic devices.
Author: Jörg Kundrat – Head of Development, Production, Technical Customer Service
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