Technologies

 

TECHNOLOGY LIBRARY

A
  • ACF Laminating/Pre-Bonding
  • B
  • Bolt & Studwelding
  •  
  • Brazing
  • C
  • Compacting
  • D
  • Dispensing
  •  
  • Drawn Arc Welding
  • E
  • Electrostatic Discharge Control
  • F
  • Fiber Laser Marking
  •  
  • Fluid Dispensing
  •  
  • Fume Extraction
  • G
  • Gap Welding
  •  
  • Green Laser Welding
  • H
  • Heat Staking
  •  
  • Heat-Sealing/ACF Final Bonding
  •  
  • Hot bar Bonding
  •  
  • Hot bar Reflow Soldering
  •  
  • Hot bar System
  • I
  • Induction Heating
  •  
  • Inscribe
  •  
  • Insulated Wire Welding
  • J
  • Jet Dispensing
  • L
  • Laser Cutting
  •  
  • Laser Marking
  •  
  • Laser Marking System
  •  
  • Laser Seam Welding
  •  
  • Laser Spot Welding
  •  
  • Laser Welding
  •  
  • Laser Welding System
  • M
  • Marking
  •  
  • Micro Joining
  •  
  • Micro Resistance Welding
  • P
  • Parallel Gap Welding
  •  
  • Plastic Welding
  •  
  • Projection Welding
  • R
  • Resistance Welding
  •  
  • Resistance Welding System
  •  
  • Robotic Soldering
  • S
  • Saw Blade System
  •  
  • Seam Welding
  •  
  • Short Cycle Studwelding
  •  
  • Single Component Positive Displacement Dispensing
  •  
  • Single Component Time/Pressure Dispensing
  •  
  • Spot Welding
  •  
  • Strand Welding
  •  
  • Studwelding
  •  
  • Studwelding with Capacitor Discharge
  • T
  • Thermocompression Welding
  •  
  • Two Component Dispensing
  • W
  • Weld Monitoring
  •  
  • Welding
  • Dispensing

    fluid dispensingNowadays, in many current production activities in different markets glue joining is frequently used. To realise the necessary connection or join, Miyachi Europe offers a number of opportunities within our fluid dispensing technology.

    To meet the demands of accuracy, speed, flexibility and cost-efficiency, we offer a complete line of products and solutions within this technology. Our products, for example, have the ability to process materials with a viscosity of 1mPas (water) to 500.000mPas correctly and accurately.

    In this way, every at first glance "difficult" bonding, is easily converted into a valuable technology.


    Our dispensing methods are:
     

    Typical applications in fluid dispensing are manual dispensing of solder paste as well as dispensing adhesive on speakers, lamps, glueing, dispensing silicone for gasketing, spraying lubrication material and many more.

    Fluid Dispensing is applied in many industries, such as Automotive, Electronics & Solar Cells,  IT & Multimedia, Medical, Aerospace, Defence.

    Medical IT & Multimedia Electronics & Solar Cells
     
     
     

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