Please download the Technical Data Sheets below for more information our two-component metering & mixing equipment:
PAR 2E Dispensing
PAR 2P Dispensing
PAR 3B Dispensing
PAR 3C Dispensing
PAR 4C Dispensing
PAR 30 Dispensing
Typical applications:
Potting and Encapsulation
Many electrical and electronic components such as coils, toroids, transformers, power supplies and printed circuit boards, are potted using polyurethanes or epoxies. The quantity dispensed may be from a few grams up to many kilograms. Also due to the continuing requirement for improved quality many customers now require components to be potted under vacuum.
Bonding
The assembly of parts using high strength adhesive systems. Beads of adhesive can be applied directly from the machine using the hand held gun.
Filling
The filling of liquids and pastes from bulk is a growing discipline within the market of electronics assembly. We supply equipment to fill syringes and cartridges.
Bead and Gasket Laying
There is often the requirement to lay precise patterns of sealant or gasketing resins onto components such as electrical fittings and motor covers to form in place gaskets. Our standard 2-component dispensing equipment is ideal for this application with working envelopes from 250mm square upwards.
"PAR Series”, a powerful and versatile range of two component liquid mixing and dispensing machines
Power, accuracy and reliability are combined in this range of systems to offer an unrivalled solution to many industrial applications, including potting and encapsulating of electronic components, casting, sealing, bonding and coating. The different types of fixed ratio pumping systems, combined with the latest in static mixing technology, provide the highest quality and consistency of mix.
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